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Number of items: 5.

Waters, Ronald T., Haddad, Abderrahmane, Griffiths, Huw, Harid, Noureddine, Charalampidis, Panagiotis and Sarkar, Partha 2011. Dry-band discharges on polluted silicone rubber insulation: control and characterization. IEEE Transactions on Dielectrics and Electrical Insulation 18 (6) , pp. 1995-2003. 10.1109/TDEI.2011.6118637

Charalampidis, Panagiotis, Waters, Ronald T., Haddad, Abderrahmane, Griffiths, Huw, Harid, Noureddine and Sarkar, P. 2011. Material tests for textured silicone rubber insulators. Presented at: International Symposium on High Voltage Engineering 17, 2011 Hannover, Hannover, Germany, 22-26 August 2011. Published in: Gockenbach, Ernst, Eichler, Christian, Mohsen, Farahani, Fischer, Markus, Gratz, Olaf, Pham, Khoi and Zhang, Xiang eds. Book of abstract / ISH 2011 August, 22 - 26, 2011, Hannover, Germany. Berlin: VDE-Verl,

Haddad, Abderrahmane, Waters, Ronald T., Griffiths, Huw, Chrzan, Krystian, Harid, Noureddine, Sarkar, Partha and Charalampidis, Panagiotis 2010. A new approach to anti-fog design for polymeric insulators. IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) 17 (2) , pp. 343-350. 10.1109/TDEI.2010.5448087

Charalampidis, Panagiotis, Haddad, Abderrahmane, Waters, Ronald T., Griffiths, Huw, Harid, Noureddine and Sarkar, P. 2010. Five-electrode inclined plane tests of textured silicone rubber samples. Presented at: 45th International Universities Power Engineering Conference, Cardiff, UK, 31 August-3 September 2010. 2010 45th International Universities Power Engineering Conference (UPEC 2010). Institute of Electrical and Electronics Engineers (IEEE), pp. 311-315.

Sarkar, Partha, Haddad, Abderrahmane, Waters, Ronald T., Griffiths, Huw, Harid, Noureddine and Charalampidis, Panagiotis 2010. Inclined-plane tests of textured silicone rubber samples. Presented at: International Conference on High Voltage Engineering and Application, New Orleans, LA, USA, 11-14 October 2010. 2010 International Conference on High Voltage Engineering and Application (ICHVE 2010). New York: IEEE, pp. 532-535. 10.1109/ICHVE.2010.5640708

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