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Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds

Auerswald, J., Niedermann, P., Dias, F., Keppner, H., Bigot, Samuel, Beckers, M. C., Nestler, J., Hiller, K., Gessner, T. and Knapp, H. F. 2007. Bonding of glass chip based SPR sensors to thermoplastic microfluidics scaffolds. Presented at: Smart Systems Integration 2007, Paris, France, 27-28 March 2007.

Full text not available from this repository.
Item Type: Conference or Workshop Item (Paper)
Date Type: Completion
Status: Unpublished
Schools: Engineering
Centre for Advanced Manufacturing Systems At Cardiff (CAMSAC)
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Last Modified: 04 Jun 2017 05:21
URI: http://orca-mwe.cf.ac.uk/id/eprint/51068

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