Menk, A. and Bordas, Stephane Pierre Alain 2009. Influence of the microstructure on the stress state of solder joints during thermal cycling. Presented at: EuroSimE 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2009, Delft, Netherlands, 26-29 April 2009. 10th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) :proceedings of a meeting held 26-29 April 2009, Delft, Netherlands. Institute of Electrical and Electronics Engineers, pp. 570-574. |
Official URL: http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumb...
Item Type: | Conference or Workshop Item (Paper) |
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Status: | Published |
Schools: | Engineering |
Publisher: | Institute of Electrical and Electronics Engineers |
ISBN: | 9781424441600 |
Related URLs: | |
Last Modified: | 04 Jun 2017 04:03 |
URI: | http://orca-mwe.cf.ac.uk/id/eprint/31595 |
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