Influence of the microstructure on the stress state of solder joints during thermal cycling

Menk, A. and Bordas, Stephane Pierre Alain 2009. Influence of the microstructure on the stress state of solder joints during thermal cycling. Presented at: EuroSimE 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2009, Delft, Netherlands, 26-29 April 2009. 10th International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) :proceedings of a meeting held 26-29 April 2009, Delft, Netherlands. Institute of Electrical and Electronics Engineers, pp. 570-574.

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Item Type:	Conference or Workshop Item (Paper)
Status:	Published
Schools:	Engineering
Publisher:	Institute of Electrical and Electronics Engineers
ISBN:	9781424441600
Related URLs:	http://ieeexplore.ieee.org/servlet/opac?...
Last Modified:	04 Jun 2017 04:03
URI:	http://orca-mwe.cf.ac.uk/id/eprint/31595

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