Cardiff University | Prifysgol Caerdydd ORCA
Online Research @ Cardiff 
WelshClear Cookie - decide language by browser settings

Influence of the microstructure on the stress state of solder joints using thermal cycling

Menk, A. and Bordas, Stephane Pierre Alain 2009. Influence of the microstructure on the stress state of solder joints using thermal cycling. Presented at: Proceedings of EuroSimE 2009, Delft, The Netherlands,

Full text not available from this repository.
Item Type: Conference or Workshop Item (Paper)
Schools: Engineering
Last Modified: 04 Jun 2017 03:06
URI: http://orca-mwe.cf.ac.uk/id/eprint/16828

Actions (repository staff only)

Edit Item Edit Item