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Lifetime prediction for solder joints with the extended finite element method

Menk, Alexander, Pearce, Chris J., Lanier, Olivier, Simpson, Robert Napier and Bordas, Stéphane Pierre Alain 2011. Lifetime prediction for solder joints with the extended finite element method. Presented at: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) 2011, 12th International Conferenc, Linz, Austria, 18-20 April 2011. 2011 12th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). New York: IEEE, pp. 113-120. 10.1109/ESIME.2011.5765773

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Abstract

Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.

Item Type: Conference or Workshop Item (Paper)
Date Type: Publication
Status: Published
Schools: Engineering
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Publisher: IEEE
ISBN: 9781457701078
Last Modified: 04 Jun 2017 03:01
URI: http://orca-mwe.cf.ac.uk/id/eprint/15549

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