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Design and characterisation of an outphasing power amplifier with balun combiner

Bogusz, Aleksander, Lees, Jonathan, Quaglia, Roberto, Watkins, Gavin T. and Cripps, Steve 2020. Design and characterisation of an outphasing power amplifier with balun combiner. Presented at: 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G), Altanta, GA, USA, 15-16 August 2019. 2019 IEEE MTT-S International Microwave Conference on Hardware and Systems for 5G and Beyond (IMC-5G). IEEE, pp. 1-3. 10.1109/IMC-5G47857.2019.9160351

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Abstract

This paper presents an outphasing power amplifier using a planar balun as power combiner. The balun with bandwidth extending to and over octave was fabricated using thin film technology on alumina substrate. The design adopts a hybrid approach, utilising a pair of bare die devices with bond-wire connections to the alumina passive networks, to minimise the extra parasitic effects introduced by packaging. The characterised prototype, that uses the TGF2023-01-2 12 W GaN HEMT from Qorvo, operates at centre frequency of 1.9 GHz and demonstrates a 15% bandwidth, where the maximum output power is maintained within 0.5 dB deviation from 41.2 dBm. On the same bandwidth, the PAE is above 55% and 44% when operating at its peak and 6 dB output back-off (OBO) output power, respectively. The Power back-off is realised by both amplitude and relative phase modulation.

Item Type: Conference or Workshop Item (Paper)
Date Type: Published Online
Status: Published
Schools: Engineering
Publisher: IEEE
ISBN: 9781728131436
Last Modified: 19 Oct 2020 12:45
URI: http://orca-mwe.cf.ac.uk/id/eprint/135704

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