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Passive components technology for THz-Monolithic Integrated Circuits (THz-MIC)

Eblabla, Abdalla, Benakaprasad, Bhavana, Li, Xu, Wallis, David, Guiney, Ivor, Humphreys, Colin and Elgaid, Khaled Passive components technology for THz-Monolithic Integrated Circuits (THz-MIC). Presented at: 18th International Radar Symposium (IRS), 2017, Prague, Czech Republic, 28-30 June 2017. Radar Symposium Conference Proceedings. pp. 1-7. 10.23919/IRS.2017.8008166

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Abstract

In this work, a viable passive components and transmission media technology is presented for THz-Monolithic Integrated Circuits (THz-MIC). The developed technology is based on shielded microstrip (S-MS) employing a standard monolithic microwave integrated circuit compatible process. The S-MS transmission media uses a 5-μm layer of benzocyclobutene (BCB) on shielded metalized ground plates avoiding any substrate coupling effects. An insertion loss of less than 3 dB/mm was achieved for frequencies up to 750 GHz. To prove the effectiveness of the technology, a variety of test structures, passive components and antennas have been design, fabricated and characterized. High Q performance was demonstrated making such technology a strong candidate for future THz-MIC technology for many applications such as radar, communications, imaging and sensing.

Item Type: Conference or Workshop Item (Paper)
Status: Published
Schools: Engineering
ISBN: 9783736993433
ISSN: 2155-5753
Last Modified: 28 Oct 2019 22:00
URI: http://orca-mwe.cf.ac.uk/id/eprint/109462

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